info for hp pavilion ze2000

Fri Dec 20 16:58:01 UTC 2013

Hello,

This is all the information I could find so far.

thanks,

eg

Attached txt file for further specs from intel website.
Below from hp partsurfer.

                                                  hp part#

Intel Celeron M 360 (1.4-GHz) with 400-MHz FSB   380033-001

Intel Celeron M 350 (1.3-GHz) with 400-MHz FSB   380032-001

System boards 

For use on models with full-featured models      381062-001
For use on models with defeatured models         381061-001

38033-001
Intel Celeron M processor 360 - 1.40GHz (Dothan, 400MHz front side bus,
512KB Level-2 cache, PPGA FC-PGA2, 478-pin, 130nm)

380032-001
Intel Celeron M processor 350 - 1.30GHz (Dothan, 400MHz front side bus,
512KB Level-2 cache, PPGA FC-PGA2, 478-pin, 130nm)

381062-001
Motherboard with Centrino technology (Full-Featured) - Includes the
Intel 855 chipset, 400MHz FSB, Intel Extreme Graphics 2, up to 64MB
video memory - Rev. B

381061-001
Motherboard with Centrino technology - Includes the Intel 852GM chipset
with 400MHz processor side bus and integrated Intel Extreme Graphics
with up to 64MB video memory

-------------- next part --------------
SPECIFICATIONS---------------------------------below

Intel® Celeron® M Processor 350-----------------------
(1M Cache, 1.30 GHz, 400 MHz FSB)

-----------------------------------   

Essentials

Status 	Launched

Processor Number 	350

# of Cores 	1

Clock Speed 	1.3 GHz

L2 Cache 	1 MB

FSB Speed 	400 MHz

FSB Parity 	No

Instruction Set 	32-bit

Embedded Options Available
	No

Lithography 	90 nm

Max TDP 	21 W

Scenario Design Power (SDP) 	0 W

VID Voltage Range 	1.260V

Recommended Customer Price 	N/A

Memory Specifications

Physical Address Extensions 	32-bit

ECC Memory Supported ‡
	No

Package Specifications

TJUNCTION 	100°C

Package Size 	35mm x 35mm

Processing Die Size 	87 mm2

# of Processing Die Transistors 	144 million

Sockets Supported 	H-PBGA478, H-PBGA479, PPGA478, PPGA479

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Turbo Boost Technology ‡ 	No

Intel® Hyper-Threading Technology ‡
	No

Intel® Virtualization Technology (VT-x) ‡
	No

Intel® 64 ‡
	No

Idle States 	No

Enhanced Intel SpeedStep® Technology
	No

Intel® Demand Based Switching
	No

Intel® Platform Protection Technology

Trusted Execution Technology ‡
	No

Execute Disable Bit ‡ 	Yes

SPECIFICATIONS---------------------------------

Intel® Celeron® M Processor 350-----------------------
(1M Cache, 1.30 GHz, 400 MHz FSB)
-----------------------------------------
---------------------------
------------------
-----------------
----------

SPECIFICATIONS-----------------------------below

Intel® Celeron® M Processor 360---------------------------
(1M Cache, 1.40 GHz, 400 MHz FSB)
--------------------------------------------

Essentials

Status 	Launched

Processor Number 	360

# of Cores 	1

Clock Speed 	1.4 GHz

L2 Cache 	1 MB

FSB Speed 	400 MHz

FSB Parity 	No

Instruction Set 	32-bit

Embedded Options Available
	No

Lithography 	90 nm

Max TDP 	21 W

Scenario Design Power (SDP) 	0 W

VID Voltage Range 	1.260V, 1.004V-1.292V

Recommended Customer Price 	N/A

Package Specifications

TJUNCTION 	100°C

Package Size 	35mm x 35mm

Processing Die Size 	87 mm2

# of Processing Die Transistors 	144 million

Sockets Supported 	H-PBGA479, PPGA478

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Turbo Boost Technology ‡ 	No

Intel® Hyper-Threading Technology ‡
	No

Intel® Virtualization Technology (VT-x) ‡
	No

Intel® 64 ‡
	No

Idle States 	No

Enhanced Intel SpeedStep® Technology
	No

Intel® Demand Based Switching
	No

Intel® Platform Protection Technology

Trusted Execution Technology ‡
	No

Execute Disable Bit ‡ 	Yes

SPECIFICATIONS-----------------------------

Intel® Celeron® M Processor 360---------------------------
(1M Cache, 1.40 GHz, 400 MHz FSB)
--------------------------------------------
-------------
---------
----------
-----------------------

SPECIFICATIONS----------------------------------------------------below

Mobile Intel® 855GME Chipset---------------------------------------------
(Intel® 82855GME Graphics and Memory Controller)
--------------------------------------------------------------

Essentials

Status 	End of Life

Launch Date 	Q4'03

Supported FSBs 	400MHz

FSB Parity 	No

Embedded Options Available 	Yes

Max TDP 	4.3 W

Recommended Customer Price 	T&R : $22.00

Memory Specifications

Max Memory Size (dependent on memory type) 	2 GB

Memory Types 	DDR-200 / DDR-266 / DDR-333

# of Memory Channels 	1

Max Memory Bandwidth 	2.7 GB/s

Physical Address Extensions 	32-bit

ECC Memory Supported ‡ 	Yes

Graphics Specifications
Integrated Graphics ‡ 	Yes

Graphics Output 	VGA, LVDS, DVO

Intel® Clear Video Technology 	No

Macrovision* License Required 	No

Expansion Options

PCI Express Revision 	1.1

Package Specifications

Max CPU Configuration 	1

TCASE 	105°C

Package Size 	37.5mm x 37.5mm

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Fast Memory Access 	No

Intel® Flex Memory Access 	No

SPECIFICATIONS---------------------------------------------------

Mobile Intel® 855GME Chipset---------------------------------------------
(Intel® 82855GME Graphics and Memory Controller)
--------------------------------------------------------------
------------------------
---------------------------
------------------
----------------

SPECIFICATIONS--------------------------below-----
----------------------------------------------
-------------------------
Mobile Intel® 855GM Chipset-------------------------------------
(Intel® 82855GM Graphics and Memory Controller)-
----------

Essentials

Status 	End of Life

Supported FSBs 	400MHz

FSB Parity 	No

Embedded Options Available 	No

Max TDP 	3.2 W

Recommended Customer Price 	N/A

Memory Specifications

Max Memory Size (dependent on memory type) 	2 GB

Memory Types 	DDR-200 / DDR-266

# of Memory Channels 	1

Max Memory Bandwidth 	2.1 GB/s

Physical Address Extensions 	32-bit

ECC Memory Supported ‡ 	Yes

Graphics Specifications

Integrated Graphics ‡ 	Yes

Graphics Output 	VGA, LVDS, DVO

Intel® Clear Video Technology 	No

Macrovision* License Required 	No

Expansion Options
PCI Express Revision 	1.1

Package Specifications

Max CPU Configuration 	1

TCASE 	105°C

Package Size 	37.5mm x 37.5mm

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Fast Memory Access 	No

Intel® Flex Memory Access 	No

SPECIFICATIONS-------------------------
----------------------------------------------
-------------------------
Mobile Intel® 855GM Chipset-------------------------------------
(Intel® 82855GM Graphics and Memory Controller)-
----------

SPECIFICATIONS--------below------------------------------------

Mobile Intel® 852GM Chipset--------------------------------------
(Intel® 82852GM Graphics and Memory Controller)-----
--------------

Essentials

Status 	End of Life

Launch Date 	Q2'04

Supported FSBs 	400MHz

FSB Parity 	No

Embedded Options Available 	Yes

Max TDP 	3.2 W

Recommended Customer Price 	N/A

Memory Specifications

Max Memory Size (dependent on memory type) 	2 GB

Memory Types 	DDR-200 / DDR-266

# of Memory Channels 	1

Max Memory Bandwidth 	2.1 GB/s

Physical Address Extensions 	32-bit

ECC Memory Supported ‡ 	No

Graphics Specifications

Integrated Graphics ‡ 	Yes

Graphics Output 	VGA, LVDS, DVO

Intel® Clear Video Technology 	No

Macrovision* License Required 	No

Expansion Options

PCI Express Revision 	1.1

Package Specifications

Max CPU Configuration 	1

Package Size 	37.5mm x 37.5mm

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Fast Memory Access 	No

Intel® Flex Memory Access 	No

SPECIFICATIONS--------------------------------------------

Mobile Intel® 852GM Chipset--------------------------------------
(Intel® 82852GM Graphics and Memory Controller)-----
--------------

SPECIFICATIONS------------below----------------------

Mobile Intel® 852GME Chipset-------------------------------
(Intel® 82852GME Graphics and Memory Controller)-----
---------------------------

Essentials

Status 	End of Life

Launch Date 	Q4'03

Supported FSBs 	533MHz

FSB Parity 	No

Embedded Options Available 	Yes

Max TDP 	5.7 W

Recommended Customer Price 	N/A

Memory Specifications

Max Memory Size (dependent on memory type) 	2 GB

Memory Types 	DDR-200 / DDR-266 / DDR-333

# of Memory Channels 	1

Max Memory Bandwidth 	2.7 GB/s

Physical Address Extensions 	32-bit

ECC Memory Supported ‡ 	Yes

Graphics Specifications

Integrated Graphics ‡ 	Yes

Graphics Output 	VGA, LVDS, DVO

Intel® Clear Video Technology 	No

Macrovision* License Required 	No

Expansion Options

PCI Express Revision 	1.1

Package Specifications

Max CPU Configuration 	1

TCASE 	110°C

Package Size 	37.5mm x 37.5mm

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Fast Memory Access 	No

Intel® Flex Memory Access 	No

SPECIFICATIONS----------------------------------

Mobile Intel® 852GME Chipset-------------------------------
(Intel® 82852GME Graphics and Memory Controller)-----
---------------------------

SPECIFICATIONS---------------below-----------------

Mobile Intel® 852PM Chipset-------------------------------
(Intel® 82852PM Memory Controller)--------
----------------

Essentials

Status 	End of Life

Supported FSBs 	533MHz

FSB Parity 	No

Embedded Options Available 	No

Max TDP 	5.7 W

Recommended Customer Price 	N/A

Memory Specifications

Max Memory Size (dependent on memory type) 	2 GB

Memory Types 	DDR-200 / DDR-266 / DDR-333

# of Memory Channels 	1

Max Memory Bandwidth 	2.7 GB/s

Physical Address Extensions 	32-bit

ECC Memory Supported ‡ 	Yes

Graphics Specifications

Integrated Graphics ‡ 	No

Graphics Output 	None

Intel® Clear Video Technology 	No

Macrovision* License Required 	No

Expansion Options

PCI Express Revision 	1.1

Package Specifications

Max CPU Configuration 	1

TCASE 	110°C

Package Size 	37.5mm x 37.5mm

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Fast Memory Access 	No

Intel® Flex Memory Access 	No

 SPECIFICATIONS--------------------------------

Mobile Intel® 852PM Chipset-------------------------------
(Intel® 82852PM Memory Controller)--------
----------------

SPECIFICATIONS--------------below------------------------------------

Mobile Intel® 852GMV Chipset----------------------------------------
(Intel® 82852GMV Graphics and Memory Controller)-------
---------------------

Essentials

Status 	End of Life

Supported FSBs 	533MHz

FSB Parity 	No

Embedded Options Available 	No

Max TDP 	3.2 W

Recommended Customer Price 	N/A

Memory Specifications

Max Memory Size (dependent on memory type) 	2 GB

Memory Types 	DDR-200 / DDR-266

# of Memory Channels 	1

Max Memory Bandwidth 	2.1 GB/s

Physical Address Extensions 	32-bit

ECC Memory Supported ‡ 	No

Graphics Specifications

Integrated Graphics ‡ 	Yes

Graphics Output 	VGA, LVDS, DVO

Intel® Clear Video Technology 	No

Macrovision* License Required 	No

Expansion Options

PCI Express Revision 	1.1

Package Specifications

Max CPU Configuration 	1

Package Size 	37.5mm x 37.5mm

Low Halogen Options Available 	See MDDS

Advanced Technologies

Intel® Fast Memory Access 	No

Intel® Flex Memory Access 	No

SPECIFICATIONS--------------------------------------------------

Mobile Intel® 852GMV Chipset----------------------------------------
(Intel® 82852GMV Graphics and Memory Controller)-------
---------------------